Publikationen - TEM/Elektronen-Tomographie

• M. Weyland, Dissertation: Two and Three Dimensional Nanoscale Analysis: New Techniques and Applications; University of Cambridge; Cambridge, 2001
• E. Zschech et al, Barrier/seed Step Coverage Analysis in Via Structures for In-laid Copper Process Control, Future Fab Intl., Issue 14, 2003
• H.J. Engelmann, D. Utess, E. Zschech, Electron Tomography for Microprocessor Structures Characterization, ANTOME Workshop on Tomography in Materials Science using TEM and FIB , HMI Berlin, 2007
• D. Utess, H.J. Engelmann, E. Zschech‚ Einsatz der TEM-Tomographie für Prozesscharakterisierung und Fehleranalyse bei der Herstellung modernster Mikroprozessoren,42. Metallographie-Tagung, Jena, 2008